Trace oxygen measurements for UHP gases in semiconductor manufacture
Ultra-High Purity (UHP) gases bulk gas piping distribution systems
The requirement for faster, higher capacity semiconductor components is driving the semiconductor process technology limits. Due to the demand for higher purity in semiconductor processes UHP gases specifications have been improved resulting in extremely low limits for impurities.
Today the production of UHP gases with virtually no contaminants (<0.1 ppb) is a common technology, although the real challenge has always been to deliver those gases at the same UHP levels all the way to the process tools. Acceptable system integrity depends upon continuous perfect operation of numerous components within the distribution system that can provide a leak path from atmosphere. If the system does break down and a leak from atmosphere of oxygen, nitrogen, carbon dioxide or moisture contaminates the process the costs can be hundred thousands of dollars in scrapped components or wafers.
Therefore, Analytical Industries' oxygen analyzers with UHP capabilities such as the PI2 UHP installed at the right location in the distribution system can effectively protect the process and help locate the leak in the distribution system. Cost savings will hugely outnumber the initial investment into the analyzer.
Applications in UHP Gases:
- Monitoring the integrity of UHP gas distribution systems
- Copper Annealing. Compact
- “Bump” Wafer Processing
- Lithography
- Curing
- Specialty gases, Halocarbons. PI2
- Inert gas furnace applications
- Bulk gas purity of critical importance. PI2 application, with POA prior to purifiers
Industry Links:
Semiconductor Industry Association
American Laboratory
Trace oxygen measurements for UHP gases in semiconductor manufacture
Ultra-High Purity (UHP) gases bulk gas piping distribution systems
The requirement for faster, higher capacity semiconductor components is driving the semiconductor process technology limits. Due to the demand for higher purity in semiconductor processes UHP gases specifications have been improved resulting in extremely low limits for impurities.| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Personnel protection against O2 deficiency in confined spaces. | <19.5-20.0% O2 | Air, N2 | GPR-35 |
| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Monitoring for oxygen contamination of UHP N2, H2, Ar carrier gases | 0 to 100 ppb O2 | N2, H2, Ar | PI2-UHP100 |
| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Non-invasive leak detection in UHP gas distribution systems with mobile cart to less than 100ppb O2 | 0 to 100 ppb O2 | N2, H2, Ar | PI2-UHP100 |
| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Monitoring oxygen contamination of UHP H2 scavenger gases used in atmosphere soldering and annealing copper films. | 0 to 100 ppb O2 | N2, H2, Ar | PI2-UHP100 |
| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Monitoring O2 contamination of high purity H2 scavenger gases used in atmosphere soldering and annealing copper films. | 0 to 1 ppm O2 | N2, H2, Ar | PI2-MS1000 |
| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Monitoring for O2 contamination of high purity N2, H2, Ar carrier gases | 0 to 1 ppm O2 | N2, H2, Ar | PI2-MS1000 |
| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Leak detection in pure gas pipelines with mobile cart to less than 1ppm O2 | 0 to 1 ppm O2 | N2, H2, Ar | PI2-MS1000 |
| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Measuring trace oxygen levels in H2 scavenger gases used in atmosphere soldering and annealing copper films. | 0 to 10 ppm O2 | N2, H2, Ar | GPR-1600 |
| Application/Service | Measurement | Gas Stream | Analyzer Options |
| Measuring O2 in ultra high purity N2 for heat treating silicon wafers | 0 to 100 ppb O2 | N2, H2, Ar | PI2-UHP100 |
